3 points for surface treatment of flexible circuit boards

As a manufacturer specializing in the production of flexible circuit boards, the industry of products used by Flyheaters has covered the optoelectronic industry, notebook manufacturing, automotive industry and instrument monitoring industry. Flyheaters has always been adhering to the business philosophy of “scientific and technological innovation, honesty and integrity”, and has been widely favored by customers in recent years. In order to enable our customers to better understand what we are doing, flyheaters's technicians summarized the surface treatment process for flexible circuit boards, and the key points can be divided into the following three points.

Anti-oxidation process
The oxidation prevention process is a chemical process that forms a thin film on the bare copper surface. This film has anti-oxidation, thermal shock resistance and moisture resistance. Therefore, in the PCB manufacturing industry, the OSP process can replace the hot air leveling technology. With the development of light, thin, short, miniaturized and multi-functional electronic products, printed flexible circuit boards are developing in the direction of high precision, thinness, multi-layer and small holes, especially the rapid development of SMT. Development, so that SMT with high-density thin plates continue to develop, making the hot air leveling process more and more not suitable for the above requirements. Compared with other processes, the anti-oxidation process is more suitable for the development of SMT technology in the electronics industry.

Tin plating
Tin plating includes both electroless tin plating and immersion tin plating. Tin plating and its alloys are coatings with good solderability and corrosion resistance, and are widely used in electronic components and printed circuit boards. Preparation of tin layer In addition to physical methods such as hot dip, spray coating, electroplating, immersion plating and electroless plating have been widely used in industry because of their simplicity.

Gold plating
In the flexible circuit board manufacturing industry, the gold plating process is similar to tin plating, using electrolysis or other chemical methods to attach gold to the surface of metal or other objects to form a thin layer of gold.

The market prospect of flexible circuit boards

Nowadays, due to the broad industrial space of flexible electronic technology, more and more industrial capital has begun to join the flexible electronics industry. As we all know, with the wide range of touch-screen phones and tablets, flexible circuit boards are more valuable. The market for flexible circuit boards is gradually expanding, but the market prospects for this device at home and abroad are still very large.

Domestic:
China's current FPC market has a low output value and a low market share. Although there are many manufacturers engaged in the research of flexible circuit boards in China, about one-third of them are foreign-invested enterprises, and their total output value accounts for more than 80% of the total domestic FPC production.

International:
According to reports, as early as 2010, Japanese soft board manufacturers NipponMektron (flag wins) revenue increased by 35% than in 2009, has reached 2.22 billion US dollars, ranking first in the world. Some other manufacturers, such as M-FLEX, are also in a position we can't surpass in terms of annual income.

So in general, the market prospects for flexible circuit boards are still considerable, but technically speaking, there are still many places in China that we must learn from others.